A TRIZ-Based Experimental Design Approach to Enhance Wave Soldering Efficiency in Electronics Manufacturing

Abstract

Wave soldering is a technological process that allows for the simultaneous soldering of multiple locations on the same circuit board. Its major defects, such as tin bridging and insufficient tin filling, continue to challenge manufacturers, resulting in increased rework, labor, and operational costs. Therefore, reducing errors in wave soldering is crucial to ensure the best quality for customers and achieve cost savings for the company. This study aims to enhance wave soldering performance by using an integrated approach that combines Teoriya Resheniya Izobreatatelskikh Zadatch (TRIZ) and Design of Experiment (DOE) for empirical improvement in an Original Equipment Manufacturer (OEM) factory, a subsidiary of a global OEM company. The results are sound: we eliminated tin till bridge defects by 88%, achieved a 33% reduction in manpower, and increased production volumes by 6%. This proposed framework can be utilized in other electronics manufacturing factories and related industries.